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1/18 www.rohm.com 2015.1 - rev.e ? 2015 rohm co., ltd. all rights reserved. compact headphone amplifiers headphone amplifier designed for 0.93v low voltage operation bu7150nuv description bu7150nuv is audio amplifier designed for singlecell battery operated audio products (vdd = 0.93 ~ 3.5v, at ta=0~85c). bu7150nuv can be selected in singleended mode for stereo headphone and btl mode for mono speaker operations. for bu7150nuv at vdd = 1.5v, thd+n = 1%, the output power is 14mw at rl = 16 in singleended mode and the output power is 85mw at rl = 8 in btl mode. features 1) wide battery operation voltage (0.93v~3.5v, ta=0~85c) (1.03v~3.5v, ta= 40~85c) 2 ) bu7150nuv can be selected in singleended mode for stereo headphone and btl mode for mono speaker operation 3) unitygain stability 4) click and popnoise reduction circuit builtin 5) shutdown mode(low power mode) 6) high speed turnon mute mode 7) thermal shutdown protection circuit 8) poweron reset circuit not sensed during startup slew rate of supply voltage 9) small package (vson010v3030) applications noisecanceling headphone, ic recorder, mobile phone, pda, electronic toys etc.. absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage vdd 4.5 v input voltage vin vss0.3~vdd+0.3 v input current iin 10~10 ma power dissipation pd 560 * mw storage temperature range tstg 55~+150 c *for operating over 25c, derate the value at 5.6mw/c. this value is for ic mounted on 74.2 mm x 74.2mm x 1.6mm glassepoxy pcb of singlelayer. operating conditions parameter symbol ratings un it min. typ. max. operation temperature range topr 40 85 c supply voltage (note 1,2) vdd 0.93 3.5 v note 1: if the supply voltage is 0.93v, bu7150nuv does not operate at less than 0c. if the supply voltage is more than 1.03v, bu7150nuv operates until 40c. (but, it is not the one which guarantees the standard value for electric characteristics.) note 2: ripple in power supply line should not exceed 400mv pp .(vdd=1.5 v, ta=25c ) no.1 5 1 02e e t01
technical note 2/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. ta=25c, vdd=1.5v, f=1khz, vss=gnd unless otherwise specified. parameter symbol limits unit conditions min. typ. max. no signal operating current idd 1 1.4 ma no load, no signal shutdown current isd 3 9 a sdb pin=vss mute current imute 15 a muteb pin=vss, se output offset voltage vofs 5 50 mv | vout1 C vout2 |, no signal maximum output power po 70 85 mw rl=8, btl, thd+n=1% 14 mw rl=16, se, thd+n=1% total harmonic distortion +noise thd+n 0.2 0.5 % 20khz lpf, rl=8, btl, po=25mw 0.1 0.5 % 20khz lpf, rl=16, se,po=5 w output voltage noise vno 10 v rms 20khz lpf + aweight crosstalk ct 85 db rl=16, se, 1khz bpf power supply rejection ratio psrr 62 db ripple voltage=200mv pp , rl=8, btl, c bypass =4.7f 66 db ripple voltage=200mv pp , rl=16, se, c bypass =4.7f input logic high level vih 0.7 v muteb pin, sdb pin input logic low level vil 0.3 v muteb pin, sdb pin btl is btlmode when mode pin = vdd, se is singleended mode when mode pin = vss. turnon time in btl mode is about 11 times faster than singleended mode. also, btl mode does not have mute mode. when muteb pin = vss, then it will be shutdown mode. . fig. 1 block diagram bias generator control logic in1 bypass muteb vdd mode out1 sdb in2 out2 vss 1 2 3 4 5 10 9 8 7 6 =v9.u3c~
technical note 3/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. ta=25c, f=1khz, vss=gnd unless otherwise specified. using circuits are fig.34 and fig.35. also, rl=16 for single ended mode, rl=8 for btl mode vdd=1.5v, se m ode 70 60 50 40 30 20 10 0 10n 100n 1u 10u 100u 1m 10m 100m thd+n [db] vdd=1.5v, po=5m w, se m ode, bw<80khz 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k thd+n [db] vdd=1.2v, se m ode 60 50 40 30 20 10 0 10n 100n 1u 10u 100u 1m 10m 100m thd+n [db] vdd=1.2v, po=2.5m w, se m ode, bw<80khz 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k thd+n [db] vdd=1.5v, btl m ode 70 60 50 40 30 20 10 0 10n 100n 1u 10u 100u 1m 10m 100m thd+n [db] vdd=1.2v, btl m ode 60 50 40 30 20 10 0 10n 100n 1u 10u 100u 1m 10m 100m thd+n [db] vdd=1.5v, po=25m w, btl m ode, bw<80khz 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k thd+n [db] vdd=1.2v, po=10m w, btl m ode, bw<80khz 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k thd+n [db] output power [w] fig. 2 thd+n vs . output power output power [w] fig. 3 thd+n vs . output power output power [w] fig. 4 thd+n vs . output power output power [w] fig. 5 thd+n vs . output power frequency [hz] fig. 6 thd+n vs . frequency frequency [hz] fig. 7 thd+n vs . frequency frequency [hz] fig. 9 thd+n vs . frequency frequency [hz] fig. 8 thd+n vs . frequency
technical note 4/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. vdd=1.5v, po=5m w, se m ode 50 40 30 20 10 0 10 10 100 1k 10k 100k 1m gain [db] vdd=1.5v, se m ode 100 90 80 70 60 50 40 30 20 10 0 100 80 60 40 20 0 output level [dbv] vdd=1.2v, se m ode 120 100 80 60 40 20 0 120 100 80 60 40 20 0 output level [dbv] vdd=1.2v, po=2.5m w, se m ode 50 40 30 20 10 0 10 10 100 1k 10k 100k 1m gain [db] vdd=1.5v, btl m ode 100 90 80 70 60 50 40 30 20 10 0 100 80 60 40 20 0 output level [dbv] vdd=1.2v, btl m ode 120 100 80 60 40 20 0 120 100 80 60 40 20 0 output level [dbv] vdd=1.5v, po=25m w, btl m ode 50 40 30 20 10 0 10 10 100 1k 10k 100k 1m gain [db] vdd=1.2v, po=10m w, btl m ode 50 40 30 20 10 0 10 10 100 1k 10k 100k 1m gain [db] input level [dbv] fig. 10 output level vs . input level input level [dbv] fig. 11 output level vs . input level frequency [hz] fig. 16 gain vs . frequency frequency [hz] fig. 17 gain vs . frequency input level [dbv] fig. 12 output level vs . input level input level [dbv] fig. 13 output level vs . input level frequency [hz] fig. 14 gain vs . frequency frequency [hz] fig. 15 gain vs . frequency
technical note 5/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. se m ode 0 20 40 60 80 100 120 140 0 1 2 3 4 power [mw] thd+n = 10% thd+n = 1% btl m ode 0 100 200 300 400 500 600 700 800 900 1000 0 1 2 3 4 power [mw] thd+n = 10% thd+n = 1% btl m ode zoom up 0 20 40 60 80 100 120 140 160 180 200 0.0 0.5 1.0 1.5 2.0 power [mw] thd+n = 10% thd+n = 1% se m ode zoom up 0 5 10 15 20 25 30 35 40 0.0 0.5 1.0 1.5 2.0 power [mw] thd+n = 10% thd+n = 1% vdd=1.2v, input=200m v pp , se m ode, input term inated into 10 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k psrr [db] vdd=1.5v, input=200m v pp , se m ode, input term inated into 10 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k psrr [db] vdd=1.5v, input=200m v pp , btl m ode, input term inated into 10 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k psrr [db] vdd=1.2v, input=200m v pp , btl m ode, input term inated into 10 90 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k psrr [db] supply voltage [v] fig. 18 maxim um output power vs . supply voltage supply voltage [v] fig. 19 maxim um output power vs . supply voltage supply voltage [v] fig. 20 maxim um output power vs . supply voltage supply voltage [v] fig. 21 maxim um output power vs . supply voltage frequency [hz] fig. 22 psrr vs . frequency frequency [hz] fig. 23 psrr vs . frequency frequency [hz] fig. 24 psrr vs . frequency frequency [hz] fig. 25 psrr vs . frequency ? ?? ? :wc(po=70m w thd+n=1%)
technical note 6/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. se m ode, input=no s ignal 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 idd [ma] se m ode, input=no s ignal 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 0 1 2 3 4 isd [a] vdd=1.5v, input=400m v pp , se m ode 90 85 80 75 70 65 60 55 50 10 100 1k 10k 100k mute level [db] vdd=1.5v, input=400m v pp , se m ode, input term inated into 10 120 110 100 90 80 70 60 50 40 10 100 1k 10k 100k crosstalk [db] vdd=1.2v, input=400m v pp , se m ode, input term inated into 10 120 110 100 90 80 70 60 50 40 10 100 1k 10k 100k crosstalk [db] vdd=1.5v, se m ode, 20khz lpf + aweight 160 140 120 100 80 60 40 20 0 10 100 1k 10k 100k noise level [dbv] vdd=1.5v, btl m ode, 20khz lpf + aweight 160 140 120 100 80 60 40 20 0 10 100 1k 10k 100k noise level [dbv] frequency [hz] fig. 26 cros s talk vs . frequency frequency [hz] fig. 27 cros s talk vs . frequency frequency [hz] fig. 28 nois e level vs . frequency frequency [hz] fig. 29 nois e level vs . frequency supply voltage [v] fig. 30 idd vs . supply voltage supply voltage [v] fig. 31 isd vs . supply voltage frequem cy [hz] fig. 32 mute level vs . frequency
technical note 7/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. ? resistors r f1 , r f2 should be used in 20k 1m range. ? for gain setting greater than 4 times, then r c1 , r c2 , c c1 , c c2 can be eliminated. fig. 34 singleended mode application circuit ? resistors r f1 , r f2 should be used in 20k 1m range fig. 35 btl mode application circuit + + + + + + +
technical note 8/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. no. pin name function i/o equal circuit 1 in1 input pin 1 a 2 sdb shutdown pin (off at l) c 3 muteb mute pin (mute at l) c 4 bypass bypass pin d 5 in2 input pin 2 a 6 vss gnd pin 7 out2 output pin 2 b 8 mode mode select pin (se at vss, btl at vdd) a 9 out1 output pin 1 b 10 vdd power supply pin in1 bypass muteb vdd mode out1 sdb in2 out2 vss 1 2 3 4 5 10 9 8 7 6 =v9.u3c~ thermal pad (bottom)
technical note 9/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. (fig. 36) . a b c d fig.36 i/o equal circuit in1 in2 mode vdd vdd 50 vdd vdd out1 out2 sdb muteb vdd 2k bypass vdd 600k 100k 100k vdd vdd
technical note 10/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. f=a0ale.?,rih+. bu7150nuv can control many mode states. active is normal operation state for output signal. shutdown is ic power down state for low power. mute is headphone amplifier power down state for low power and fast turnon, because keeping bias voltage = vdd/2. turn on and turn off are sweep state. also, bu7150nuv has wait time for reduction of popsound at turnon and turnoff. turnon wait time is 70msec from in1 voltage = vdd/2. turnoff wait time is 140msec from bypass voltage = 100mv. please don't change sdb, muteb condition at 70msec and 140msec wait time. fig. 38 timing chart (mode = vdd: btl mode) fig. 37 timing chart (mode = vss: singleended mode)
technical note 11/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. . ftb2h.=a0h.lhad.%aelrd.vh5h+. bu7150nuv need waittime for bias charge sweep time and popnoise reduction. in the fig. 37, ts1 is bias charge sweep time from power on or sdb=h. ts2 is time until signal output from power on or sdb=h. also, in the fig. 38, tb1 is bias charge sweep time from power on. tb2 is time until signal output from power on. tb3 is bias charge sweep time from sdb=h. tb4 is time until signal output from sdb=h. these values are decided equation (1) ~ (6). however, bias charge sweep time (ts1, tb1, tb3) have uneven 50%, and waittime (70msec) is 40msec ~ 126msec for process parameter distribution. (ta=25c) (1) [sec] 102.5 cvdd ts1 6 bypass ??? = )2( [sec]07.01ts2ts ??? + = ( ) (3) [sec] 1027.5 c2vdd tb1 6 bypass ??? + = )4( [sec]07.01tb2tb ??? + = (5) [sec] 1027.5 cvdd tb3 6 bypass ??? = )6( [sec]07.03tb4tb ??? + = in the fig. 38, tb1 and tb3 is differ value, because bu7150nuvs default is singleended mode. bu7150nuv need bypass>100mv to recognize for btl mode. also, td is delay time to c i1 =vdd/2 from bypass=vdd/2. td is decided by c i1 , r i1 , and r f1 . fig. 39 flow of time until signal output
technical note 12/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. . fv5hirha2l.02ch+. . ? selecting operation mode bu7150nuv has two opamp in the ic (fig. 1). bu7150nuv is selected for btlmode for mono speaker and singleended mode for stereo headphone operation. mode is composed of external parts and internal control (fig. 34, 35) bu7150nuv operates at singleended mode when mode pin (pin8) = 0v turn on. btl mode is operated when mode pin (pin8) = vdd turn on. bypass voltage = 100mv then operation mode is decided by internal comparator by detecting mode voltage. the difference between singleended mode and btlmode is mentioned in the following table. parameter single ended mode mode='vss' btl mode mode='vdd' mute function enable disenable bypass voltage turn on time [ts1, tb1, tb3] (c bypass =4.7f) ts1=2.82sec tb1=598msec tb3=256msec time until signal output [ts2, tb2, tb4](c bypass =4.7f) ts2=2.89sec tb1=668msec tb3=326msec maximum output power (thd=1%) 14mw 85mw total harmonic distortion + noise 0.10% 0.20% power supply rejection ratio 66db 62db (ta=25 , vdd=1.5v, f=1khz)
technical note 13/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. ? singleended mode singleended mode can be use for stereo headphone amplifier using two internal amplifiers. bu7150nuv can select amplifier gain a v using external parts. (fig. 34) two amplifiers gain a v is decided by input resistance r i1 , r i2 and feedback resistance r f1 , r f2 aspect. also, please, use r f1 , r f2 value in the range 20k~1m. amplifier outputs (out1, out2) need coupling capacitors in singleended mode operation. coupling capacitors reduce dcvoltage at the output and to pass the audio signal. singleended mode has mute mode. mute mode reduces pop noise and low power (typ. 15a when muteb pin = low. ? rise time is highspeed though current consumption increases more than the state of the shutdown so that the state of the mute may keep the output level at the bias level. mute level is decided by input resistance r i1 , r i2 and feedback resistance r f1 , r f2 and r l mute level [db] bu7150nuv needs phasecompensation circuit using external parts. (fig. 34) but, for amplifier gain av > 4 then phase compensation circuit may be eliminated. ? btl mode btl mode can be used for mono speaker amplifier using two internal amplifiers. bu7150nuv can select amplifier gain a v using external parts. (fig. 35) 1st stage gain is decided by selecting external parts. but 2nd stage gain = 1. 1st stage output signal and 2nd stage output signal are of same amplitude but phase difference of 180. amplifiers gain a v is decided by input resistance r i1 and feedback resistance r f1 aspect. also, please, use r f1 , r f2 value in range of 20k~1m. bu7150nuv has no output pop noise at btl mode operation, because output coupling capacitor is not charged. therefore, btl mode is faster by 11 times compared to singleended mode. sdb pin and muteb pin are same function in btl mode operation. i f v r r a ?= fi l rr r log20 + = 1i 1f v r r 2a ?=
technical note 14/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. ftb2h.arya00.vh5h.92nhi+. maximum output power of audio amplifier is reduced line impedance. please, design to provide low impedance for the wiring between the power source and vdd pin of bu7150nuv. also, please design to provide low impedance for the wiring between the gnd and vss pin of bu7150nuv. vdd power source impedance gnd impedance speaker impedance fig. 40 line impedance
technical note 15/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. ftb2h.r.h,hi0rd.9ts+. this product has a thermal pad at the rear side of the package for heat dissipation and connecting it to gnd plane will provide better heat dissipation. in the event that the ic will exceed its allowable heat dissipation, connect the thermal pad to gnd plane. furthermore, heat dissipation properties can be improved by increasing the copper foil area of the printed board, which can also provide high allowable dissipation. additionally, exceeding the allowable dissipation will lead to deterioration of the ic. please handle the thermal pad according to the list shown below by a setting mode and supply voltage. note 3 thermal pad is not a gnd terminal. please give the gnd electric potential from vss terminal (6pin). ? figure 41. power dissipation vs temperature figure 42. handling of thermal pad condition (btl mode) setting allowable dissipation handling of thermal pad se mode (r l =16 ) i do not exceed it it is open or is connected to the gnd pattern ( n o t e 3) se mode (r l =8) v dd < 2.9v v dd 2.9v exceed i am connected to the gnd pattern ( n ote 3) (i allow even opening by a condition. reference figure42) condition 1: when mounted on 1layer 74.2 mm x 74.2 mm x 1.6 mm glassepoxy pcb no copper foil (only mounting pattern) condition 2: when mounted on 4layer 74.2 mm x 74.2 mm x 1.6 mm glassepoxy pcb6.28mm 2 copper foil (back layer) a nd 5,505mm 2 copper foil (layers 2 & 3) when mounted on 1layer 74.2 mm x 74.2 mm x 1.6 mm glassepoxy pcb no copper heat sink (only mounting pattern) operation temperature : topr [c] power dissipation : pd [mw] supply voltage : v dd [v] output power : po [mw]
technical note 16/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. fm2n.h2.ghdhoh.hyhhilrd.5rihg.l2i.r55daorha2l+. . ? power supply capacitor power supply capacitor is important for low noise and rejection of alternating current. please use 10f electrolytic or tantalum capacitor for low frequency and 0.1f ceramic capacitor for high frequency nearer to bu7150nuv. ? bypass pin capacitor bu7150nuv sweeps active state after 70msec wait time after in1 voltage = vdd/2. in1 voltage are subordinated bypass voltage ts. bypass voltage is subordinated bypass pin capacitor c bypass . therefore, high speed turn on time is possible if c bypass is small value. but, pop noise may occur during turn on time. therefore, c bypass need to be selected best value for application.
technical note 17/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteristics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ics power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. in this regard, for the digital block power supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong electromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connected to a lowimpedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the transportation and the storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if smallsignal gnd and largecurrent gnd are provided, it will be recommended to separate the largecurrent gnd pattern from the smallsignal gnd pattern and establish a single ground at the reference point of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the smallsignal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance due to dc bias and changes in the capacitance due to temperature, etc. (12) about the rush current for ics with more than one power supply, it is possible that rush current may flow instantaneously due to the internal powering sequence and delays. therefore, give special consideration to power coupling capacitance, power wiring, width of gnd wiring, and routing of wiring. (13) others in case of use this lsi, please peruse some other detail documents, we called ,technical note, functional description, application note.
technical note 18/18 upf/81npu www.rohm.com 1/8w/. r. ohmw c ? 2015 rohm co., ltd. all rights reserved. b d 7 1 5 0 n u v e 2 part no. part no. package nuv : vson010v3030 packaging and forming specification e2: embossed tape and reel (unit : mm) vson010v3030 s 3.00.1 3.00.1 1pin mark 1.0max (0.22) s 0.08 0.02 +0.03 - 0.02 610 51 0.40.1 0.5 0.5 2.00.1 1.20.1 0.25 +0.05 - 0.04 c0.25 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of produ ct is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 ( ) direction of feed reel 1pin
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number bu7150nuv package vson010v3030 unit quantity 3000 minimum package quantity 3000 packing type taping constitution materials list inquiry rohs yes bu7150nuv - web page distribution inventory

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